Advanced Lithography Homogenization

Lithography coupling paths integrate passive ball, hemispherical and collimating lenses for efficient mode conversion and beam shaping. They collimate divergent light into uniform spots, boost coupling efficiency, and ensure lithography resolution and uniformity — core passive components for domestic lithography system replacement.

Wafer Defect Inspection

Bright/dark field inspection lenses use passive hemispherical and ball lenses to collect wafer surface scattered light, enabling accurate detection of nano-scale particles and pattern defects. Collimating lenses focus DUV paths for sub-diffraction super-resolution imaging; collimated polarization paths distinguish real defects from film thickness artifacts, reducing false positives.

Critical Dimension Metrology

Optical CD metrology tools use collimating lenses to focus probe beams for non-destructive, precise measurement of linewidth, via depth and overlay offset. Ball lenses act as reference path delay elements to cancel vibration errors via interferometry; collimating lenses enable fast beam angle switching for multi-angle metrology, supporting high-precision measurement of complex 3D structures such as FinFET and GAA.

Thin Film Metrology and Advanced Packaging

Ellipsometer paths integrate passive ball lenses to generate ultra-small measurement spots, enabling high-precision repeatable measurement of dielectric/metal film thickness and refractive index, meeting multi-layer film characterization needs for Chiplet and 3D IC stacking. Collimating lenses collimate broadband white light in spectroscopic ellipsometers for consistent focal points across spectra; hemispherical lenses support high-curvature sample measurement, covering TSV, micro-bump and other advanced packaging inspection scenarios.

Laser Annealing

Ellipsometer paths integrate passive ball lenses to generate ultra-small measurement spots, enabling high-precision repeatable measurement of dielectric/metal film thickness and refractive index, meeting multi-layer film characterization needs for Chiplet and 3D IC stacking. Collimating lenses collimate broadband white light in spectroscopic ellipsometers for consistent focal points across spectra; hemispherical lenses support high-curvature sample measurement, covering TSV, micro-bump and other advanced packaging inspection scenarios.

Mask Inspection & Repair

DUV inspection paths couple to high-NA objectives via hemispherical lenses for precise mask defect localization, guiding laser or e-beam targeted repair. As passive beam-combining elements, collimating lenses co-axially inject inspection and repair lasers for WYSIWYG repair. They maintain high transmittance in VUV bands, ensuring accurate repair energy delivery.